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Course Criteria
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3.00 Credits
Introduces the student to fundamental digital imaging processing concepts and their application to the fields of robotics, automation, and signal processing. Topics include: digital image filters, two dimensional transforms, boundary descriptors, Hough transform, automated visual inspection techniques, vision for robot control, 3-D vision, and hardware architectures to support vision. Graded: Graded Student. Units: 3.0
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3.00 Credits
Current neural network architectures and electronic implementation of neural networks are presented. Basics of fuzzy logic is covered. Application software will be used to simulate training. Testing of various neural net architectures. Learning strategies such as back-propagation, Kohonen, Hopfield and Hamming algorithms will be explored. A final project requires the student to design, train and test a neural network for electronic implementation that solves a specific practical problem. Graded: Graded Student. Units: 3.0
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3.00 Credits
Introduction to robot kinematics and dynamics followed by a comprehensive treatment of robot control. Topics include: independent joint control, multivariable control, force control, feedback linearization, real-time parameter estimation, and model-reference adaptive control. Prerequisite: EEE 184 or equivalent. Graded: Graded Student. Units: 3.0
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3.00 Credits
Covers core topics and circuits important for analog and mixed-signal integrated circuits. Topics include: device structures and models, single-stage and differential amplifiers, current mirrors and active loads, operational amplifier design, stability and compensation, fully-differential circuits and common-mode feedback, noise in integrated circuits and the impact of IC processes on analog performance. Prerequisite: EEE 109 or instructor permission. Graded: Graded Student. Units: 3.0
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3.00 Credits
Advanced Analog and Mixed Signal Integrated Circuit Design. A companion course to EEE 230, covers additional topics important in analog and mixed-signal integrated circuit design. Topics include traditional issues such as device matching and analog layout techniques, as well as important building blocks such as bandgap references and bias circuits. Also included are current-mode techniques such as high-speed current-mode logic (CML), and an introduction to noise in integrated circuits. Circuit and layout projects are assigned using CAD software. Prerequisite: EEE 230 or consent of the instructor. Graded: Graded Student. Units: 3.0
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3.00 Credits
Key Mixed-Signal Integrated Circuit Building Blocks. Covers key mixed-signal integrated circuit building blocks most often used in modern ICs. Topics covered include data converter fundamentals, comparators, and important circuit architectures for Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Phase-Locked Loops (PLLs). Prerequisite: EEE 230 or consent of instructor. Graded: Graded Student. Units: 3.0
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3.00 Credits
The background and techniques needed to design and layout digital circuits at the transistor level for mixed-signal integrated circuits are covered. Topics include the design, layout and characterization of digital logic gates at the transistor level, typical CMOS process flows, device models and physics, and chip level considerations. Prerequisite: EEE 230 or instructor permission. Graded: Graded Student. Units: 3.0
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1.00 Credits
Methods to develop successful mixed-signal integrated circuits using an industrial design methodology and computer-aided design tools. Proven design techniques presented; hands-on experience gained through each student designing their own integrated circuit. Communications skills developed through periodic presentations, including reviews for the circuit architecture, design and layout. Prerequisite: EEE 230 or consent of the instructor. Graded: Graded Student. Units: 1.0
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3.00 Credits
Semiconductor device modeling, including the application of the continuity equation and Poissons equation to abrupt and graded p/n junctions, semiconductor/metal contacts, junction field effect transistors (JFET), metal-oxide-semiconductor transistors (MOSFET), and bipolar junction transistors (BJT). Special topics include compound semiconductor devices and heterostructures. Graded: Graded Student. Units: 3.0
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3.00 Credits
Focus on integrated circuit design-for-test-techniques; semiconductor reliablity factors and screening; semiconductor fabrication processes, device physics and related performance limitations; quantifying cost/quality tradeoffs; IC manufacturing flows and high-accuracy parametric test methods. Prerequisite: CPE 151 and CPE 166. Graded: Graded Student. Units: 3.0
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