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Course Criteria
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3.00 Credits
Principles of materials science applied to materials issues in fabrication, operation, and reliability of microelectronic devices. (Spring)
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3.00 Credits
This course studies the analysis and design of nonlinear feedback control systems. Topics include: Lyapunov stability, Input-Output Stability of Perturbed Systems, Model-reference adaptive control, sliding mode control, Lyapunov redesign methods, back stepping, and feedback linearization. (Alternate fall)
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3.00 Credits
An introduction to the manipulation and analysis of digital images, intended as a foundation for research in such fields as visual communications, medical imaging, and image analysis. Specific topics include human visual effects, filtering, compression, restoration, and reconstruction.
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3.00 Credits
The course focuses on those aspects of quantum theory that are of particular relevance to electrical engineering. It is intended to give seniors and first-year graduate students a working knowledge of quantum mechanics at a level sufficient to illuminate the operation of standard and advanced quantum devices. Topics include classical mechanics versus quantum mechanics, early quantum theory, Schrödinger formulation, time-dependent and time-independent Schrödinger equation, Dirac formulation, Bloch theorem, magnetic effects, open quantum systems, and density matrices.
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3.00 Credits
Standard undergraduate treatments of data analysis and modeling include important basic ideas of regression and goodness of fit. However, several significant real-world issues are rarely addressed adequately in these introductory courses. This course will discuss many of the problems scientists and engineers routinely encounter when dealing with data and will provide rigorous methods for handling them: measurement uncertainty analysis, data flyer removal, impact of sampling on model quality, dealing with correlated inputs, and residual analysis. In the end, students should have the tools necessary to answer one of the foundational questions of science: given two competing scientific models (theories), does the data contain sufficient information to choose one over the other?
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3.00 Credits
Lithography is the patterning technique used in the fabrication of semiconductor integrated circuits. Advances in lithography over the last two decades have fueled the explosive growth of the microelectronics industry. In fact, future advances in microelectronics are being gated by advances in lithography. This course will cover the basic theory and technology of today's state-of-the-art in semiconductor lithography.
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4.00 Credits
Introduction to Transmission Electron Microscopy (TEM) applied to metals, ceramics and semiconductors. TEM optics, electron diffraction, image formation modes and mechanisms, specimen preparation and practical TEM operation, and analyical techniques for chemical analysis.
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3.00 Credits
This course treats the optical characterization techniques that are employed to investigate the physical propoerities of modern semiconducting materials. A brief overview will first be given of the basic science and growth of these materials, and the theory for their optical characterization. A detailed description will then be provided of measurement techniques, illustrated by examples of the application of these techniques to current semiconductor research and technology. Emphasis will be given to the use of these techniques to investigate low dimensional nanostructures such as quantum wells, wires, and dots.
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3.00 Credits
This course will address the physical layer of wireless communication channels. Topics will include: modeling of the wireless channel (e.g. propagation loss, fading), interference models and cell planning, multiple access, modulation and equalization techniques, well-suited to wireless communications. Standards for cellular systems and wireless LANs will be used to motivate and illustrate.
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3.00 Credits
Design for manufacture looks at the process of designing a product for high volume manufacture. Topics covered include manufacturing variation and design robustness in the face of variation, design validation (assuring the design does what it is intended to do) and verification (assuring the design implementation matches the design and meets manufacturing constraints, testability, reliability.
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