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Course Criteria
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2.00 Credits
A supervised and evaluated on-the-job training experience designed to provide practical application of the skills and methodology of manufacturing maintenance.
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2.00 Credits
A supervised and evaluated on-the-job training experience designed to provide practical application of the skills and methodology of manufacturing maintenance.
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3.00 Credits
This course will provide an overview of basic nanofabrication processing equipment and materials handling procedures. The focus is on procedural, safety, environment and health issues in equipment operation and materials handling. Topics to be covered will include: cleanroom operation, safety and health issues; vacuum pump systems operation, environmental safety, and health issues (covering direct drive mechanical, roots blowers, turbonmolecular, and dry mechanical systems); furnace operation, safety, environmental and health issues (covering horizontal, vertical, rapid thermal annealing tools); chemical vapor deposition system operation, safety, environmental and health issues (covering gas delivery, corrosive and flammable gas storage and plumbing, regulators, and mass flow controls); and vacuum deposition/etching system operation, safety, environment and health issues covering microwave and RF power supplies and tuners, heating and cooling units, vacuum gauges, valves and process controllers. Specific materials handling issues will include DI water, solvents, cleansers, ion implantation sources, diffusion sources, photoresists, developers, metals, dielectrics, and toxic, flammable, corrosive and high purity gases as well as packaging materials
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3.00 Credits
This course will provide an overview of basic processing steps in nanofabrication. The majority of the course details a step-by-step description of the equipment and processes needed to fabricate devices and structures. Processing flow will be examined for structures such as microelectromechanical (MEM) devices, biomedical "lab-on-achip" structures, display devices and microelectronic devices including diode, transistor and full CMOS structures. Students will learn the similarities and differences in both equipment and process flow for each configuration by undertaking "hands-on" processing.
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3.00 Credits
This course will cover thin film deposition and etching practices in nanofabrication. The deposition techniques to be included in the first part of the course will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtering; thermal evaporation; and beam evaporation physical vapor deposition. Materials to be considered will include dialectics (nitride, oxide), polysilicon (doped and undoped) metals (aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching (single wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Student will receive hands-on experience in depositing and etching dielectric, semiconductor and metal materials using state-of-the-art tools and practicing many of the steps critical to nanofabrication of semiconductor devices including microelectronic, MEMs devices, display structures and structures used in the biotechnology fields.
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3.00 Credits
This specific course will cover all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. Most of the emphasis will be on understanding the nature and behavior of photoresist materials. The second section examines the process from development through inspection (both before and after pattern transfer). This section will introduce optical masks, aligners, steppers and scanners. In addition, critical dimension (CD) control and profile control of photoresists will be investigated. The last section will discuss advanced optical lithographic techniques such as phase shifting masks and illumination schemes as well as 3-beam, X-ray, EUV, and ion beam lithography.
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3.00 Credits
This course will cover in detail the processing steps used in modifying material properties in nanofabrication. Included will be growth and annealing processes utilizing horizontal and vertical furnaces as well as rapid thermal annealing. The impact of thermal processing and thermal processing on defects, gettering, impurities and overall electrical mechanical, optical, electrical and chemical properties will be studied. The student will grow and measure gate and field oxides, implant and activate source and drain regions, and evaluate thermal budget requirements using state-of-the-art tools. Included also will be other modification technologies such as ion implantation, diffusion and surface preparation and treatment. Substrate preparation processing such as slicing, etching, polishing and epitaxial growth will be covered.
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3.00 Credits
This course will examine a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection will be discussed. Characterization techniques such as: SEM, XPS/Auger, surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry and resistivity/conductivity to yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, C-V and I-V tests and simple transistor characterization. In addition, we will examine mechanical as well as electrical characteristics of some simple MEMs devices and chemical and biological responses of nanofabricated biomedical structures. The student will also learn about the manufacturing issues involved in subjects such as interconnects, isolation and final device assembly. Aluminum, refractory metals and copper deposition techniques and characterization will be discussed in detail along with topics such as diffusion barriers, contact resistance, electromigration, corrosion, stress effects and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional ICs and novel MEM and biomedical devices will be examined.
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2.00 Credits
A supervised and evaluated on-the-job training experience designed to provide practical application of the skills and methodology of manufacturing maintenance.
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2.00 Credits
A supervised and evaluated on-the-job training experience designed to provide practical application of the skills and methodology of manufacturing maintenance.
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