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Course Criteria
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3.00 Credits
Concepts of computer networks and architectures. Network topology, connectivity analysis, delay analysis, local access design. Physical layer, data link layer, higher layer protocols. Study of networks as distributed embedded systems. Routing, flow control, congestion control. Local area networks. PREREQ: ECE 332.
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3.00 Credits
Hardware description languages and hardware programming languages as a practical means to simulate/implement hybrid sequential and combinational systems. Actual design and implementation of sizeable digital design problems using the most up-to-date industry Computer Aided Design tools and Field-Programmable Gate Arrays. PREREQ: ECE 430 or PERM/INST.
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3.00 Credits
Fundamentals of integrated circuit and micro-electromechanical systems (MEMS) fabrication technology; semiconductor substrates; theory of unit processes such as diffusion, oxidation, ion implantation, rapid thermal processing, photolithography, wet etching and cleaning, dry etching, thin-film deposition; chemical mechanical polishing; process integration; metrology; statistical process control; TCAD. PREREQ: ECE 323 or PERM/INST. COREQ: ECE 440L.
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0.00 Credits
Semiconductor cleanroom practices; heavy lab safety; students will fabricate and test simple structures in lab; application of TCAD to practical problems. COREQ: ECE 440.
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3.00 Credits
Advanced models for unit processes such as diffusion, oxidation, ion implantation, thin film deposition, etching, rapid thermal processing, chemical mechanical polishing, and lithography. CMOS, bipolar, and microelectromechanical systems (MEMS) process integration. Process and device modeling using TCAD. PREREQ: ECE 440.
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3.00 Credits
Principles of optics, diffraction, interference, superposition of waves, imaging systems, fundamentals of microlithography, resolution, contact and projection lithography, photoresist processing, metrology. Phase shift masks, anti-reflective coatings, deep-ultraviolet lithography, off-axis annular illumination. Use of TCAD lithography simulation software. COREQ: ECE 340.
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0.00 Credits
Cleanroom lab experience accompanying ECE 442, utilizing a projection-printing wafer stepper, photoresist wafer track, SEM, and optical metrology equipment. Use of TCAD lithography simulation software. PREREQ: ECE 342. COREQ: ECE 442.
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3.00 Credits
Signals, noise, propagation and protocol in analog and digital communication systems. Bandwidth, Fourier transforms, signal to noise ratio and receiver noise figures. Introduction to modern wireless communication systems such as cellular, wireless data and satellite data systems. PREREQ: ECE 350, and MATH 360 or MATH 361.
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0.00 Credits
Lab experience accompanying ECE 451 utilizing AM/FM modulation, spectrum analysis, receiver design and analysis. PREREQ: ECE 350. COREQ: ECE 451.
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3.00 Credits
Modern cellular communication systems, including propagation, handoff, noise, and interference studies. CDMA and other spread-spectrum systems. PREREQ: ECE 451.
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