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Institution:
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Boise State University
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Subject:
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Description:
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Advanced models for unit processes such as diffusion, oxidation, ion implantation, thin film deposition, etching, rapid thermal processing, chemical mechanical polishing, and lithography. CMOS, bipolar, and microelectromechanical systems (MEMS) process integration. Process and device modeling using TCAD. PREREQ: ECE 440.
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Credits:
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3.00
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Credit Hours:
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Prerequisites:
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Corequisites:
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Exclusions:
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Level:
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Instructional Type:
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Lecture
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Notes:
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Additional Information:
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Historical Version(s):
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Institution Website:
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Phone Number:
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(208) 426-1011
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Regional Accreditation:
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Northwest Commission on Colleges and Universities
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Calendar System:
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Semester
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