|
|
|
|
|
|
|
|
|
|
Course Criteria
Add courses to your favorites to save, share, and find your best transfer school.
-
2.00 Credits
This course is designed for students that are learning about their career goals and are ready to prepare to enter the workforce. It will help to develop the knowledge and skills needed to take those first steps. Students will learn about topics ranging from workplace basics, job search and application skills up to interviewing. Throughout the course, students will receive applicable skills and templates for resumes and cover letters to use in their real-world job search.
-
2.00 Credits
This course is designed for students that are about to enter the workforce. It will help to develop the knowledge and skills needed to be successful in a new job. Students will learn about topics ranging from managing job responsibilities to communicating or resolving issues with supervisors and coworkers. Throughout the course, students will receive applicable skills and gain a deeper understanding of how they fit into the workforce and what will motivate them to be successful
-
3.00 Credits
This is designed for students that are looking to build on their education and work experience to advance their career. It will help to take their workplace skills and experience to further develop strategies in order to build the long-term career they want. Students will learn about topics ranging from general aspects of career advancement to their operating style and developing leadership skills. Throughout the course, students will receive applicable skills and learn techniques to chart industry specific career goals.
-
3.00 Credits
Introduces students to the process of developing, implementing, and monitoring individualized instructional strategies. Implementation of Individualized Education Programs (IEP) through goals and objectives is emphasized. Requirement: Ten hours of field experiences and classroom observations.
-
3.00 Credits
Emphasizes the role of assistive technology and universal design for learning as a related service in supporting children with exceptionalities in educational environments as a related service. Students identify national, state, and local resources and address legal requirements and funding issues. Students are given the opportunity for hands-on experiences with a wide array of technological devices. Requirement: Ten hours of field experiences and classroom observations.
-
6.00 Credits
The course is the culmination of the educational experience of the paraprofessional. This experience allows the student to spend 270 hours in a field placement in an actual classroom under the supervision of the professional certified teacher. The practicum student will be exposed to both inclusive and /or specialized settings to introduce the practicum student to the role and responsibilities of the paraprofessional in relationship to the student, family, and educators. The course supports the acquisition of knowledge and skills for collaboration and positive communication with students and other professionals within diverse learning environments.
-
3.00 Credits
Provides an overview of basic Nanofabrication processing equipment and materials handling procedures. The focus is on procedural, safery, environment, and health issues in equipment operation and materials handling. Topics to be covered will include: cleanrooms operations, safety, and health issues; vacuum pump systems operation,environmental, safety, and health issues (covering direct drive mechanical roots blowers, turbomolecular, and dry mechanical systems); furnace operation, safety, environmental, and health issues (covering horizontal, vertical, rapid thermal annealing tools); chemical vapor deposition system operation, safety, environmental, and health issues (covering gas delivery, corrosive and flammabel gas storage and plumbing, regulators, and mass flow controllers); and vacuum deposition/ethching system operation, safety, environmental, and health issues (covering microwave and RF power supplies and tuners, heating and cooling units, vacuum gauges, valves, and process controllers). Specific materials handling issues will include DI water, solvens, cleansers, ion implantation sources, diffusion sources, photoresists, developers, metals, dielectrics, and toxic, flammable, corrosive, and high purity gases as well as packaging materials.
-
3.00 Credits
Provides an overview of basic processing steps in Nanofabrication. The majority of the course details a step-by-step description of the equipment and processes needed to fabricate devices and structures. Processing flow will be examined for structures such as microelectromechanical (MEM) devices, biomedical "lab-on-a-chip" structures, display devices, and microelectronic devices including diode, transistor, and full CMOS structures. Students will learn the similarities and differences in both equipment and process flow for each configuration by undertaking "hands-on" processing.
-
3.00 Credits
Covers thin film deposition and etching practices in nanofabrication. The deposition techniques to be included in the first part of the course will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtinger, thermal evaporation, and beam evaporation physical vapor deposition. Materials to be considered will include dielectrics (nitride, oxide), polysilicon (doped and undoped), metals (aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching (single, wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Students will receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools and practicing many of the steps critical to Nanofabrication of semiconductor devices, including microelectronics, MEMs devices, display structures, and structures used in the biotechnology fields.
-
3.00 Credits
Covers all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. Most of the emphasis will be on understanding then nature and behavior of photoresist materials. The second section examines the process from development through inspection (both before and after pattern transfer). This section will introduce optical masks, aligners, steppers and scanners. In addition, critical dimension (CD) control and profile control of photoresists will be investigated. The last section will discuss advanced optical lithographic techniques such as phase shifting masks and illumination schemes as well as e-beam, e-ray, EUV, and ion beam lithography.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Privacy Statement
|
Terms of Use
|
Institutional Membership Information
|
About AcademyOne
Copyright 2006 - 2024 AcademyOne, Inc.
|
|
|