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Course Criteria
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5.00 Credits
This is an applications and systems oriented course with emphasis placed on op amp and linear IC based circuit analysis and design.
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4.00 Credits
This course is an introduction to digital logic and circuits. Characteristics of major families and their applications. Combinational logic synthesis, reduction and analysis techniques, as well as state machine design are covered. This course meets the General Education Competency of Critical Thinking (CT).
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4.00 Credits
Power Concepts covers the area of electricity concerned with the operation, applications, and control of rotating electrical machinery, polyphase power systems and transformers. Process control, motor control circuits and the maintenance of power equipment will also be presented.
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4.00 Credits
This course introduces the student to the applications and operation of microprocessors and microprocessor-based systems. CPU architecture, assembly language programming and interfacing using common microprocessors and microcontrollers, and programmable logic devices are studied. Microprocessor applications in robotics, control systems, telecommunications and data acquisition are also covered.
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2.00 Credits
This is a supervised work or research experience which allows the student to grow professionally, to apply learned theory to practical situations, and to gain an appreciation of the roles, duties, responsibilities, and nature of the work that has been chosen as a career. This is a required course for all Electronics majors. The assembling of kits such as those available from Heathkit, Graymark, Radio Shack, etc., are not acceptable research projects.
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3.00 Credits
This course provides an overview of the materials, safety and equipment issues encountered in the practice of "top down" and "bottom up" nanofabrication. It focuses on safety, environmental and health issues in equipment operation and materials handling as well as on cleanroom protocol. Topics to be covered include: cleanroom operation, OSHA lab standard safety training, health issues, Biosafety Levels (BSL) guidelines, and environmental concerns. Safety issues dealing with nanofabrication equipment, materials, and processing will also be discussed including those pertinent to biological materials, wet benches, thermal processing tools, plasma based equipment, stamping and embossing lithography tools, vacuum systems and pumps, gas delivery systems and toxic substance handling and detection. Specific material handling procedures to be discussed will include corrosive, flammable, and toxic materials, biological materials, carcinogenic materials, DI water, solvents, cleaners, photo resists, developers, metals, acids, and bases. The course will also concentrate on safe equipment maintenance and operation. Students will be given an overview of basic nanofabrication materials, equipment and equipment operation. This technical overview and operational introduction to processing equipment and characterization tools will include: chemical processing, furnaces, vacuum based processing (physical vapor deposition equipment, chemical vapor deposition equipment, and dry etching equipment), and lithography as well as scanning probe microscopy (e.g., atomic force microscopy), optical microscope, electron microscopy (e.g., scanning electron microscopy) ellipsometer, nanospec, and profilometer equipment.
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3.00 Credits
This course is the hands-on introduction to the processing involved in "top down", "bottom up", and hybrid nanofabrication. The majority of the course details a step-by-step description of the equipment, facilities processes and process flow needed to fabricate devices and structures. Students learn to appreciate processing and manufacturing concerns including process control, contamination, yield, and processing interaction. The students design process flows for micro- and nano-scale systems. Students learn the similarities and differences in "top down" and "bottom up" equipment and process flows by undertaking hands-on processing. This hands-on exposure covers basic nanofabrication processes including colloidal chemistry, self assembly, catalyzed nanoparticle growth, lithography, wet and dry etching, physical vapor deposition, and chemical vapor deposition.
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3.00 Credits
This course is an in-depth, hands-on exposure to materials fabrication approaches used in nanofabrication. Students learn that these processes can be guided by chemical or physical means or by some combination of these. Hands-on exposure will include self-assembly; colloidal chemistry; atmosphere, low-pressure and plasma enhanced chemical vapor deposition; sputtering; thermal and electron beam evaporation; nebulization and spin-on techniques. This course is designed to give students hands-on experience in depositing, fabricating and self-assembling a wide variety of materials tailored for their mechanical, electrical, optical, magnetic, and biological properties.
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3.00 Credits
This course is a hands-on treatment of all aspects of advanced pattern transfer and pattern transfer equipment including probe techniques; stamping and embossing; e-beam; and optical contact and stepper systems. The course is divided into five major sections. The first section is an overview of all pattern generation processes covering aspects from substrate preparation to tool operation. The second section concentrates on photolithography and examines such topics as mask template, and mold generation. Chemical makeup of resists will be discussed including polymers, solvents, sensitizers, and additives. The role or dyes and antireflective coatings will be discussed. In addition, critical dimension (CD) control and profile control of resists will be investigated. The third section will discuss the particle beam lithographic techniques such as e-beam lithography. The fourth section covers probe pattern generation and the fifth section explores embossing lithography, step-and-flash, stamp lithography, and self assembled lithography.
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3.00 Credits
This course will cover in detail the processing techniques and specialty hardware used in modifying properties in nanofabrication. Material modification steps to be covered will include etching, functionalization, alloying, stress control and doping. Avoiding unintentional materials modification will also be covered including such topics as use of diffusion barriers, encapsulation, electromigration control, corrosion control, wettability, stress control, and adhesion. Hands-on materials modification and subsequent characterization will be undertaken.
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