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Course Criteria
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3.00 Credits
Credits: 3 Prerequisites: None Corequisites: None Type: LEC Topics and instructors vary by semester.
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3.00 Credits
Credits: 3 Prerequisites: EE 311 Corequisites: None Type: LEC Fabrication technology for microelectronic devices: crystal growth, wafer fabrication and characterization, mask fabrication, epitaxy, lithography, etching, diffusion, CVD, ion implantation, dc and RF plasma reactors (operating principles and fabrication applications), packing. Operation of microelectronic devices (interconnects, passive devices, and MOS and BJT devices), micro-optical devices (CDRs, etc.) and micro electro-mechanical devices (micro-motors, micro-mirror arrays, etc). Students select a part of the fabrication process (lithography, diffusion, etc.) and use simulation code to design that step of the process to achieve specific device properties.
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3.00 Credits
Credits: 3 Prerequisites: EE 311 Corequisites: None Type: LEC Introduces analog integrated circuit fabrication and layout design for analog VLSI. Covers: representative IC fabrication processes (standard bipolar, CMOS and analog BiCMOS); layout principles and methods for MOS transistors and device matching; resistors and capacitors layout; matched layouts of R and C components; bipolar transistors and bipolar matching; and diodes. Also reviews several active-loaded analog amplifier circuits, focusing on CMOS and BiCMOS op amp configuration. Requires a term project on the layout design of simple op amp circuits involving CMOS or BiCMOS op amps plus several matched devices of resistors, capacitors and transistors. Students design circuits using SPICE simulations. The student term project is to be fabricated through MOSIS.
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3.00 Credits
Credits: 3 Prerequisites: None Corequisites: None Type: LEC Topics and instructors vary by semester.
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3.00 Credits
Credits: 3 Prerequisites: None Corequisites: None Type: LEC/LAB Provides students with the experience of fabricating a semiconductor device. Students become versed in fabrication techniques used in the microelectronics industry. Required student activities include mask design, chemical processing, operation of clean room equipment, and testing of the final device. Also requires a report.
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3.00 Credits
Credits: 3 Prerequisites: EE 311 Corequisites: None Type: LEC First, discusses the basics of p-n junctions including current flow, and recombination. In addition, discusses solar cell fundamentals, heterojunctions, metal-insulator-semiconductor devices, design, and recent advances. The course ends with a discussion of photodetector principles, design, and applications.
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3.00 Credits
Credits: 3 Prerequisites: EE 401 or permission of instructor Corequisites: None Type: LEC The second course of a two-course sequence in the area of RF and microwave circuit design. Topics covered are filters, resonators, detectors, mixers, amplifiers, and microwave systems. Microwave Office is used for CAD analysis of circuits. Students design, construct, fabricate, and measure the performance of a microstrip resonator, a microstrip or stripline directional coupler, and a filter.
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3.00 Credits
Credits: 3 Prerequisites: EE 401 or EE 49 or permission of instructor Corequisites: None Type: LAB/REC Covers RF & microwave measurement techniques in the 1 MHz to 18 GHz frequency region. Topics include assembling basic measurement systems, including attenuators, directional couplers, power dividers, terminations, power sensors, solid-state detectors, mixers, power meters, and signal generators; measuring the reflection and transmission coefficients at discrete frequencies; making similar measurements (magnitude only) over a band of frequencies using a swept power measurement system consisting of a spectrum analyzer with tracking generator; vector measurements (magnitude and phase) versus frequency using RF & microwave automatic network analyzers.
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3.00 Credits
Credits: 3 Prerequisites: permission of instructor and student s advisor Corequisites: None Type: LEC Special topics of particular recent interest not covered in the standard curriculum. Requires dual registration in department office.
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3.00 Credits
Credits: 3 Prerequisites: permission of instructor and student s advisor Corequisites: None Type: LEC Involves a design project based on electric energy systems that specifically address power modulation applications and that is firmly based on the fundamentals needed to become a successful engineer. Students form Integrated Project Teams (IPTs) to work on the capstone project and answer all the questions that will be required of them when they leave the academic environment. Students are challenged to incorporate engineering standards and realistic constraints that include the economy, environment, sustainability, manufacturability, ethical considerations, health and safety issues, social issues, and politics as stated by ABET. Both technical reports and technical presentations are required of IPT participants.
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