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Course Criteria
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2.00 Credits
This course introduces students to the engineering design process and solid modeling. Students learn visualization skills, parametric solid modeling and creation of engineering drawings which meet industrial drafting standards. Design projects are used to reinforce concepts and provide practical design experience. Class 3, Lab 2, Credit 4
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2.00 Credits
This course is intended for transfer students who have a background in a solid modeling package other than is used in 0610-220. Students will learn the fundamentals of Solidworks, in preparation for taking 0610-220. (Permission of instructor) Lab 2, Credit 1
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2.00 Credits
A course dealing with concepts in data acquisition and control and application of computers for manufacturing process integration. This course will introduce the concepts in digital and hexadecimal number systems, digital logic, parallel and serial communication, microcomputer architecture, sensors and actuators and real-time programming. Concepts in networking and distributed systems will also be introduced. Students will use C or C++ programming language to control experimental setups in the laboratory. (C or C++ Programming) Class 3, Lab 2, Credits 4
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4.00 Credits
This is the second of two courses that teaches manufacturing processes. The fi rst covers basic traditional processes and this course goes on to cover what are commonly referred to as nontraditional manufacturing methods. Within this category are processes such as electrical discharge machining, water jet machining, photochemical machining, ultrasonic machining, lasers, plasma cutting, rapid prototyping, etc. This is a project based course; the student will individually, or in a team, investigate one of the processes in depth, and how it is applied to a specifi c part. (0617-220) Class 4, Credit 4
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4.00 Credits
A study of techniques required to make economic decisions. Topics covered in the course include cash fl ow analysis, present worth analysis, annual worth analysis, rate of return evaluations, benefi t cost analysis, break even analysis, replacement analysis, bonds, the effect of tax on cash fl ows, and sensitivity analysis. Class 4, Credit 4
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4.00 Credits
This course in production and operations management focuses on operations terminology, operations strategy, design for manufacturing, project planning/ control, value analysis, and statistical quality control. (1016-319) Class 4, Credit 4
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4.00 Credits
This course is designed to provide the student with knowledge of the latest theories and practices of operations management employed by world class manufacturing organizations. Topics include TQM, MRP, JIT, lean manufacturing, six sigma, theory of constraints, work simplifi cation and operations research. Class 4, Credit 4
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4.00 Credits
This course will provide a thorough understanding of the technology, components, equipment, design and manufacturing process for surface mount electronics manufacturing. As an introductory course, it will provide students with a strong foundation needed for advanced work in surface mount technology (SMT). The laboratory demonstrations will provide the students an orientation and familiarization of the manufacturing equipment and process for printed circuit board assembly (0609-411) Class 4, Credit 4
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2.00 Credits
This course deals with advanced topics in surface mount electronics Packaging. Topics include: electronics packaging standards, single- chip and water level packaging technologies, advanced passive component technology, high density interconnection and microvia technology, thermal management, thermomechanical behavior of packaging , solder metallurgy and joint formation for packaging, failure modes, mechanisms and reliability testing. (0617-455) Class 2, Lab 2, Credit 4
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2.00 Credits
This laboratory class will provide the hands-on training in surface mount electronics packaging. Students will learn to set-up and operate production scale equipment, understand process parameters and their infl uence and characterize the entire PCB assembly process. Lab experiments will also include analytical evaluation of raw materials such as solder paste viscosity, tackiness, wetting, component and board solder ability, solder balling, etc. Class 0, Lab 2, Credit 1
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