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Course Criteria
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3.00 Credits
This course is an introduction to microwave circuit design and analysis techniques, with particular emphasis on applications for modern microwave communication and sensing systems. An integrated laboratory experience provides exposure to fundamental measurement techniques for device and circuit characterization at microwave frequencies. Students will develop an enhanced understanding of circuit design and analysis principles as applied to modern microwave circuits, as well as become familiar with design techniques for both hand analysis and computer-aided design. An appreciation for basic measurement techniques for characterization of microwave devices, circuits, and systems through laboratory experiments will also be developed. Fall.
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3.00 Credits
CMOS devices and circuits, scaling and design rules, floor planning, data and control flow, synchronization, and timing. Individual design projects.
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3.00 Credits
Missions, spacecraft dynamics, attitude determination and control, space environment, spacecraft power, telecommunications, avionics, data handling/processing, and other topics that may include configuration, load determination and structure, and thermal control. Spring.
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3.00 Credits
A hands-on overview of the important role of photons alongside electrons in modern electrical engineering. Photonics technologies studied include lasers, optical fibers, integrated optics, optical signal processing, holography, optoelectronic devices, and optical modulators. A survey of the properties of light, its interactions with matter, and techniques for generating, guiding, modulating, and detecting coherent laser light. Spring.
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3.00 Credits
An introduction to the theory and application of digital information processing: analog/digital and digital/analog conversion, transform domain representation of discrete-time signals and systems, Z-transform, signal flow graphs, discrete Fourier transform, fast Fourier transforms, frequency analysis, filter design, filter structures, Wiener filter, finite-precision effects, applications in communications, and the analysis and synthesis of audio and image data. Spring.
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3.00 Credits
Device-level operation of digital and analog integrated circuits. Covers the elements of silicon bipolar and MOS logic, GaAs logic, and volatile and non-volatile memory. Topics in analog ICs include the design of transistors optimized for particular applications such as high bandwidth, AC and DC analysis of analog circuits, and subcircuits used in analog ICs. Design issues.
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3.00 Credits
Design for manufacture looks at the process of designing a product for high volume manufacture. Topics covered include manufacturing variation and design robustness in the face of variation, design validation (assuring the design does what it is intended to do) and verification (assuring the design implementation matches the design and meets manufacturing constraints, testability, reliability.
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3.00 Credits
The first part of a yearlong senior design project. In this part, students will choose a project, develop the paper design, plan the implementation, and purchase necessary materials. Fall.
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3.00 Credits
The second part of a yearlong senior design project. In this part, students implement, test and document their senior project. Spring.
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0.00 Credits
This lab supplements the materials presented in the lecture setting and gives students the opportunity to reinforce their learning through hands-on experiments and through demonstrations in a laboratory environment.
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