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Course Criteria
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0.00 Credits
Released Time
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4.00 Credits
2-4-4 Engineering 102 provides for the development of analytical and communication skills by problem solving, teamwork and project presentation. The course gives instruction on how to use computers in engineering: how to utilize engineering software, problem solving, data acquisition and analysis. Included is how to use a computer algebra system to solve math and engineering problems. Students learn the elements of the engineering design process through execution of actual design projects. Other topics include an introduction to patents and patent law and the interaction between the engineer and physical environment. Prerequisite: MATH 162 or a higher-level math course.
Prerequisite:
MATH 162 or a higher-level math course.
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4.00 Credits
2-4-4 This course is a continuation of Engineering Design and Laboratory I. It provides for the development of analytical and communication skills by problem solving, teamwork and project presentation. The course gives instruction on how to use computers in engineering: how to utilize engineering software, problem solving, data acquisition and analysis. In addition, students learn technical sketching and computer-aided drafting techniques with industry-standard software. Students learn the elements of the engineering design process through execution of actual design projects. Prerequisite: ENGR 102.
Prerequisite:
ENGR 102.
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4.00 Credits
3-2-4 Students will learn to recognize and differentiate between the several types of engineering solids, understand solids at the atomic level in terms of bonding and energy, establish a quantitative picture of the structure of crystalline and non-crystalline solids, explain atomic movements in solids using the concept of diffusion, explain the electrical and magnetic properties of different kinds of materials, and understand the processes that give rise to the degradation of materials. They will also learn to interpret the optical behavior of materials in terms of the interaction of electromagnetic radiation with the material, and choose materials optimally for engineering design purposes. Prereqs: PHYS 241, MATH 172.
Prerequisite:
Prereqs: PHYS 241, MATH 172.
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3.00 Credits
2-2-3 This course provides students with an overview of equipment and materials utilized in nanofabrication processes, as well as a review of safety factors related to both equipment and materials. The focus is on procedural, environmental, safety and health issues in equipment operation and material handling. Prereq: ENGR 210. Coreq: ENGR 212.
Prerequisite:
ENGR 210. Coreq: ENGR 212.
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3.00 Credits
2-2-3 This course provides students with an overview of the basic processing steps in nanofabrication and the equipment processes needed to fabricate devices and structures. Processing flow will be examined for structures such as microelectromechanical (MEM) devices, biomedical "lab-on a-chip structures, display devices and microelectronic devices, including diode, transistor, and full CMOS structures. Prereq: ENGR 210. Coreq: ENGR 211.
Prerequisite:
ENGR 210. Coreq: ENGR 211.
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3.00 Credits
2-2-3 This course will cover thin film deposition and etching practices in nanofabrication. The deposition techniques covered will include atmospheric, low pressure, and plasma enhanced chemical vapor deposition. Materials to be considered will include dielectrics, polysilicon, metals, adhesion promoters and diffusion barriers. The second part of the course will focus on etching processes and will emphasize reactive ion etching, high-ion-density reactors, ion beam etching and wet chemical etching. Prereqs: ENGR 210 and 211. Prereq/Coreq: ENGR 212.
Prerequisite:
Prereqs: ENGR 210 and 211. Prereq/Coreq: ENGR 212.
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3.00 Credits
2-2-3 This course will cover all aspects of lithography from design and mask fabrication to pattern transfer and inspection. Topics covered will include substrate preparation, the nature and behavior of photoresist materials, exposure, optical masks, aligners, steppers, scanners, control of critical dimensions and profiles, and advanced optical lithography techniques. Prereq: ENGR 210. Pre/Coreqs: ENGR 211 and ENGR 212. Coreq: ENGR 213.
Prerequisite:
ENGR 210. Pre/Coreqs: ENGR 211 and ENGR 212. Coreq: ENGR 213.
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3.00 Credits
2-2-3 This course will explore in detail the process steps used in modifying material properties nanofabrication. Included will be growth and annealing processes utilizing horizontal and vertical furnaces as well as rapid thermal annealing. The impact of thermal processing on defects, impurities and overall electrical, mechanical, optical and chemical properties will be studied. The student will grow and measure gate and field oxides, implant and activate source and drain regions, and evaluate thermal budget requirements, using state-of-the-art tools. Ion implant- ation, diffusion and surface preparation and treatment will also be covered. Prereqs: ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 216.
Prerequisite:
Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 216.
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3.00 Credits
2-2-3 This course will examine a variety of techniques and measurements essential for controlling device fabrication and final packaging. Monitoring and characterization techniques will be discussed. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. In addition, the course will examine mechanical and electrical characteristics of simple MEMS devices, and chemical and biological responses of nano- fabricated biomedical structures. Students will also learn about the manufacturing issues involved in topics such as interconnects, isolation and final device assembly. Prereq: ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 215.
Prerequisite:
ENGR 210. Pre/Coreqs: ENGR 211, ENGR 212, ENGR 213, ENGR 214. Coreq: ENGR 215.
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