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Course Criteria
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3.00 Credits
This course provides an overview of basic nanofabrication processing equipment and materials handling procedures with a focus on safety, environment, and health issues. Topics covered include: cleanroom operation, environmental, safety, and health issues, vacuum pump systems operation, environmental safety and health issues (covering direct drive mechanical, roots blowers, turbomolecular, and dry mechanical systems); thermal- processing equipment operation, safety, environmental, and health issues (covering horizontal, vertical, rapid thermal annealing tools); chemical vapor deposition system operation, safety, environmental, and health issues (covering gas delivery, corrosive and flammable gas storage and plumbing, regulators, and mass flow controllers); and vacuum deposition/etching system operation, safety, environment, and health issues (covering microwave and RF power supplies and tuners, heating and cooling units, vacuum gauges, valves, and process controllers). Specific materials handling issues include those arising from using deionization water, solvents, cleansers, organic materials, ion implementation sources, diffusion sources, photoiesists, developers, metal dielectrics and toxic, flammable, corrosive and high purity gases as well as packaging materials.
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3.00 Credits
The course provides an overview of basic processing steps used in all applications of nanofabrication. Both top-down and bottom-up nanofabrication are included. The majority of the course details a step-by-step description of the equipment and processes needed to fabricate devices and structures such as bio- chips, CMOS transistors, power devices, microelectromechanical (MEM) devices, and opto-electronic structures. Students learn the similarities and differences in both the equipment and process flows needed in fabricating all of these various structures.
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3.00 Credits
This course covers thin film deposition and etching practices in nanofabrication. The deposition techniques addressed in the first part of the course include atmospheric, low pressure, and plasma enhanced chemical vapor deposition and sputtering, thermal evaporation, and beam evaporation physical vapor deposition. Also included are self-assembling molecule based techniques. Materials considered include organics, dielectrics (e.g., nitrides, oxides), polysilicon (doped and undoped), metals (e.g., aluminum, tungsten, copper), adhesion promoters and diffusion barriers. The second part of the course focuses on etching processes and emphasizes reactive ion etching (single wafer, batch), high-ion-density reactors, ion beam etching and wet chemical etching. Students receive hands-on experience in depositing and etching dielectric, semiconductor, and metal materials using state-of-the-art tools and experience practicing the steps critical to micro- and nanofabrication of structures used in a variety of fields from biotechnology and the biomedical fields to microelectronics.
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3.00 Credits
This course covers all aspects of lithography from design and mask fabrication to pattern transfer and inspection. The course is divided into three major sections. The first section describes the lithographic process from substrate preparation to exposure. The second section examines the processes from development through inspection (both before and after pattern transfer). This section introduces optical masks, aligners, steppers and scanners. In addition, critical dimension (CD) and profile control of photoresists are investigated. The last section discusses advances in optical lithographic techniques such as phase shifting masks and illumination schemes as well as molecular ruler, e-beam, x-ray, EUV, and ion beam lithography.
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3.00 Credits
This course covers in detail the processing steps used in modifying material properties in nanofabrication. Included are chemical reaction, growth and annealing processes. The impact of thermal processing and thermal processing on defects, gettering, and impurities and overall electrical, mechanical, optical, and chemical properties are studied. The student grows and measures gate and field oxides, implants and activates source and drain regions, and evaluates thermal budget requirements using state-of-the-art tools. Included also are other modification technologies such as ion implantation, diffusion and chemical surface preparation and treatment. Substrate preparation processing such as slicing, etching, polishing and epitaxial growth are also covered.
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3.00 Credits
This course examines a variety of measurements and techniques essential for controlling micro- and nanofabrication processes. Monitoring techniques such as residual gas analysis (RGA), optical emission spectroscopy (OES) and end point detection are discussed. Characterization techniques such as scanning electron microscopy x-ray photoelectron spectroscopy, atomic probe methods advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurements are introduced and tied to process control. Basic measurements for yield analysis and process control are also stressed. These include breakdown measurements, junction testing, and capacitance-voltage and current voltage characterization. In addition, the characteristics of some simple bio-chip structures and MEMs devices are obtained and discussed. The student learns about the manufacturing issues involved in interconnects, materials compatibility and final device assembly. Aluminum, refractory metals and plastic fabrication techniques and characterization are discussed in detail along with topics such as diffusion barriers, contact resistance, electro migration, corrosion, and adhesion. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing are emphasized. Lastly, procedures such as die separation, bonding, and sealing and final test for both conventional Cs and MEMs and biomedical devices are examined.
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1.00 - 12.00 Credits
Supervised placement and research in selected public and private agencies.
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3.00 Credits
In this introductory course in quantum mechanics, the foundations and origins will be covered. Other topics will include wave packets, the uncertainty principle, the Schroedinger equation, operator formalism, eigen functions, spherically symmetric systems, angular momentum, spin and scattering theory.
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1.00 - 3.00 Credits
Investigation of the theoretical or experimental area following a plan or proposal initiated by the student and approved by the major advisor. Independent Study courses give students the opportunity to pursue research and/or studies that are not part of the university's traditional course offerings. Students work one on one or in small groups with faculty guidance and are typically required to submit a final paper or project as determined by the supervising professor.
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1.00 - 6.00 Credits
A workshop is a program which is usually of short duration, narrow in scope, often non-traditional in content and format, and on a timely topic.
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