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Course Criteria
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3.00 Credits
The diffusion process in metals and alloys. Solution to Fick's law. Self-diffusion. Effect of temperature upon diffusion. Grain boundary and surface diffusion. Solution and diffusion of gases in metals. Diffusion in carburizing, the austenite transformation, powder metallurgy, and the scaling of metals and alloys. When Offered: Fall term alternate years. Credit Hours: 3
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3.00 Credits
Review of essential quantum mechanics, including exact models and approximate methods. Application to behavior of electrons in solids. Electronic energy bands in metals, semiconductors, and insulators. Charge carrier statistics and transport. Maxwell's equations. Dielectric, optical, and magnetic properties. Applications to semiconductor, optoelectronic, and magnetic devices. When Offered: Spring Credit Hours: 3
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3.00 Credits
Review of elasticity and plasticity theory. Calculation of theoretical cohesive strength of crystalline solids; influence of stress concentrations on fracture strength. Fractography. Theory and applications of linear elastic fracture mechanics. Fracture testing. Elastic-plastic fracture mechanics. Dislocation theories of cleavage fracture. Phenomenology and theories of stress corrosion cracking, creep rupture, fatigue. When Offered: Fall term. Credit Hours: 3
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3.00 Credits
Discussion of selected advanced and emerging topics in microelectronics materials and fabrication. These may include metallization, thin film deposition, interconnection technology, microlithography, plasma etching and processing. Credit Hours: 3
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4.00 Credits
The phenomenological, mechanistic and micro-structural aspects of the mechanical properties of materials are developed, with particular emphasis on the similarities and differences among various material systems including metals, ceramics and polymers. Phenomenological aspects of the three-dimensional characteristics of stress and strain, various yield criteria, elastic behavior, viscoelastic behavior, plastic behavior, statistical aspects of brittle fracture and fracture mechanics are presented. Mechanistic and micro-structural topics include edge and screw dislocation behavior, slip systems, critical resolved shear stress, dislocation multiplication and interactions, barriers to motion, polymer chain conformation and entropy. When Offered: Fall Credit Hours: 4
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3.00 Credits
Theory and practice of IC fabrication in a research laboratory environment. Test chips are fabricated and the resulting devices and circuits evaluated. Processes and fabrication equipment studied and used include oxidation/diffusion, CVD reactors, photolithography, plasma etching, vacuum evaporator, ion implantation, etc. Instruments used in process monitoring and final testing include thin film profilometer, ellipsometer, resistivity probe, scanning electron microscope, capacitance-voltage system, etc. The fundamentals of hazardous material handling and clean room procedures are studied. Prerequisites/Corequisites: Prerequisite: ECSE 4250 or equivalent. When Offered: Spring term annually . Cross Listed: Cross-listed as ECSE 6300. Students cannot obtain credit for both this course and ECSE 6300. Credit Hours: 3
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3.00 Credits
Principles and practice of producing, measuring, and using pressures from atmospheric down to 10-15 atmospheres. Gas kinetics and flow of gases at low pressures. Basic vacuum system calculations. System design and leak detection. Physical and chemisorption of gases. Generation of clean surfaces and study of reactions on them. When Offered: Spring term. Credit Hours: 3
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3.00 Credits
The thermodynamics and reactivity of surfaces. Classical thermodynamics of surfaces. Atomistic models of the crystal surfaces. Electron diffraction from surface layers. Surface diffusion. Physical and chemisorption of gases, chemical reactions at surfaces. Nucleation of surface and bulk phases. When Offered: Spring term. Credit Hours: 3
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3.00 Credits
Principles and applications of current techniques for the chemical, structural, and morphological characterization of engineering materials, with an emphasis on materials used in the microelectronics industry. Techniques studied include various electron and ion spectroscopies, electron microscopies, and diffraction techniques. When Offered: Fall term odd numbered years. Credit Hours: 3
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3.00 Credits
Thermodynamics, kinetics, and morphologies of solid-liquid interfaces. Heat flow phenomena in casting and crystal growth. Structure of molten systems. Physical chemistry of vacuum processing. Mechanics of solidification of metals under equilibrium and nonequilibrium conditions. Nucleation and growth phenomena. Solute redistribution during freezing. Metal transport during freezing. Grain size control. Application of theory to production of engineering alloys. When Offered: Fall term alternate years. Credit Hours: 3
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