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Course Criteria
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3.00 Credits
The course deals with the design and optimization of thermal systems. The course covers selection of typical components of thermal systems such as heat exchangers, pumps and fans, econimic analysis of thermal systems, system simulations, and different methods of optimization, and their applications in the optimization of thermal systems culminated in a group optimization project. A formal oral presentation of a written technical report is required. Prerequisites: MEEN 3310, 3340, 3380 Offered: Spring
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3.00 Credits
This course deals with the theory, design and simulation of internal combustion engines. The theory of internal combustion engines covers thermodynamics and fuel-air cycles, fuels and their properties, intake and exhaust flows, combustion and pollutant emissions, heat transfer and modelling of IC engines. IC engine simulation software will be used to solve practical IC engine problems. Current status and future challenges of IC engines will also be discussed. Offered: Other
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3.00 Credits
General analysis of stress and strain, equations of equilibrium and compatibility, stress and strain relations, two dimensional stress problems, elastic energy principles, thermoelastic problems. May be repeated for credit when the subject matter varies. Offered: Other
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3.00 Credits
Process selection in design, based on attributed of shaping, joining and surface treatment processes. Estimation of cost of shaping processes. Computer-aided process selection. Microstructure evolution is processing. Process selection for hybrid material products. Offered: Fall
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3.00 Credits
Theory of fracture mechanics with engineering applications advanced stress analysis using finite element (FEA) analysis with emphasis on the cracked structures. Offered: Other
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0.00 - 3.00 Credits
This course introduces microelectronics manufacturing processes, FEA techinques and the applications; stress analysis, thermal analysis, modal analysis and thermal stress analysis. Offered: Other
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0.00 - 3.00 Credits
This course introduces microelectronics manufacturing processes, FEA techinques and the applications; stress analysis, thermal analysis, modal analysis and thermal stress analysis. Offered: Other
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0.00 - 3.00 Credits
Students will learn advanced FEA techniques and the applications, advanced knowledge in solid mechanics and its applications, and advanced skills with ANSYS software. Offered: Other
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0.00 - 3.00 Credits
Students will learn advanced FEA techniques and the applications, advanced knowledge in solid mechanics and its applications, and advanced skills with ANSYS software. Offered: Other
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3.00 Credits
Topics in mechanical vibrations including an introduction to the theory of vibrations, mechanical vibration methods of analysis including finite element modeling, mechanical vibration measurement and monitoring, interpretation of vibration measurements data and other mechanical vibration topics as appropriate. Offered: Other
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