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Course Criteria
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3.00 Credits
Object-oriented languages and systems built with object-oriented software components. Object-oriented design methodologies, such as CRC cards and the Unified Modeling Language (UML). Requirement analysis. Design patterns. Agile methods. Object-oriented programming environments, such as the Eclipse platform. Platforms for Web services, such as J2EE. Project required.
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3.00 Credits
Design of digital Application Specific Integrated Circuits (ASICs) based on Hardware Description Languages (Verilog, VHDL) and CAD tools, particularly login synthesis. Emphasis on design practices and underlying algorithms. Introduction to timing-driven design, low-power design, design-for-test and ASIC applications. Project.
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3.00 Credits
Design of general-purpose computers through cost-performance analysis. Emphasis on making design decisions regarding the instruction set architecture and organization of single-processor computer. Discussion of design choices, role of compiler and techniques for analysis, simulation and implementation. Consideration of relationships between architecture, organization and technology
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3.00 Credits
Fundamentals of medical instrumentation systems, sensors, and biomedical signal processing. Example instruments for cardiovascular and respiratory assessment. Clinical laboratory measurements, theraputic and prosthetic devices, and electrical safetyrequirements. Students should have background in electronics design using operational amplifiers.
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3.00 Credits
This course investigates photonic devices at the component level and examines the generation, propagation and detection of light in the context of optical communication systems. Topics include planar and cylindrical optical waveguides, LEDs, lasers,optical amplifiers, integrated optical and photodetectors, design tradeoffs for optical systems, passive optical networks, and wavelength division multiplexed systems.
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3.00 Credits
Introduction to the electrical, optical, chemical, and physical measurement techniques to characterize semiconductor materials and devices. Topics include measurement of carrier concentrations, series resistance, barrier heights, minority carrier lifetime, leakage, trap levels, dielectric charge, threshold voltage, and channel mobility; time-dependent phenomena such as hot carrier injection and trapping, bias-temperature stability and dielectric breakdown. Review of analytical techniques to measure defects, impurities, physical dimensions, and structure.
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3.00 Credits
Properties of charged particles under influence of fields and in solid materials. Quantum mechanics, particle statistics, semi-conductor properties, fundamental particle transport properties, p-n junctions.
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3.00 Credits
Analysis of operating principles of transistor structures. Basic semi-conductor physics reviewed and used to provide explanation of transistor characteristics. Development and usage of device-equivalent circuits to interpret semi-conductor-imposed limitations on device performance. Devices analyzed include MISFIT'S, HEMT'S, Bipolar transistors, PBT'S, heterojunction BJT'S and SIT's.
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3.00 Credits
Principles required to understand behavior of electronic circuits operating at microwave frequencies. Review of elector-magnetic theory and establishing an understanding of techniques required for working with electronic circuits at microwave and millimeter-wave frequencies. Discussion of circuit components operating at these frequencies.
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3.00 Credits
DC and AC analysis of isolated and non-isolated switch mode power supply. Basic converter topologies covered include: buck, boost and buck/boost and their transformer-couples derivatives. Design of close loop of these DC/DC converters. Power devices and their applications in DC/DC converters. Inductor and transformer design.
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