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ECE 225: Circuit Analysis And Design
3.00 Credits
Boise State University
Single-phase and three-phase AC circuits. Mutual inductance and transformers. Laplace transforms and circuit applications. Transfer functions, Bode plots, frequency response, and resonant circuits. Fourier series and filter circuit design. Two-port networks. PREREQ: ECE 210 and MATH 333.
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ECE 225 - Circuit Analysis And Design
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ECE 225L: Circuit Analysis And Design Lab
0.00 Credits
Boise State University
Lab work to accompany. ECE 225 Circuit Analysis and Design. COREQ: ECE 225.
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ECE 225L - Circuit Analysis And Design Lab
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ECE 230: Digital Systems
3.00 Credits
Boise State University
Number systems, Boolean algebra, logic gates, Karnaugh mapping, combinatorial circuits, flip-flops, registers, counters, sequential statemachines. Construction of small design projects. PREREQ: COMPSCI 117 or COMPSCI 125.
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ECE 230 - Digital Systems
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ECE 230L: Digital Systems Lab
0.00 Credits
Boise State University
Design, construction, and test of small digital logic circuits using TTL and CMOS gates, flip-flops, registers, counters, LED's. COREQ: ECE 230.
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ECE 288: Sophomore Outcome Assessment
0.00 Credits
Boise State University
Competency-based examination to assess student ability in mathematics, basic sciences and engineering. Required for admission to upper-division ECE curriculum (Pass/Fail.) PREREQ: ECE 210, ECE 230, ENGR 245, MATH 333. COREQ: COMPSCI 225, ECE 225, MATH 275, PHYS 212.
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ECE 288 - Sophomore Outcome Assessment
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ECE 310: Electrical Properties of Materials. Mse 310)
3.00 Credits
Boise State University
Physical principles underlying the electrical properties of metals, insulators and semiconductors. The effects of energy band structure, thermal properties and impurities on electrical conduction. Concepts covered are applied to electrical devices including nanodevices, MOSFETs and optoelectronic devices. May be taken for ECE or MSE credit, but not both. PREREQ: ENGR 245, MATH 333 and PHYS 309 or ECE 225.
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ECE 310 - Electrical Properties of Materials. Mse 310)
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ECE 322: Microelectronic Circuits
3.00 Credits
Boise State University
Circuit design and analysis using diodes, bipolar junction transistors, and MOSFETs. Introduction to design with op-amps. Circuit simulation with SPICE. PREREQ: ECE 225 and ECE 288.
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ECE 322 - Microelectronic Circuits
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ECE 322L: Microelectronic Circuits Lab
0.00 Credits
Boise State University
Hands-on design, construction, and test of electronic circuits using signal generators, power supplies, and oscilloscopes. COREQ: ECE 322.
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ECE 322L - Microelectronic Circuits Lab
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ECE 323: Semiconductor Devices
3.00 Credits
Boise State University
Fundamentals of solid-state electronic devices. Energy band theory, drift, diffusion, generation and recombination of carriers. Physics, modeling, and biasing of diodes, MOSFETs, BJTs. Electronics of metal-semiconductor junctions and the MOS capacitor structure. SPICE model development. Introduction to 2-D device design software. PREREQ: ENGR 245 and ECE 322.
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ECE 323 - Semiconductor Devices
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ECE 323L: Device Characterization Lab
0.00 Credits
Boise State University
Measurement of PN junction, BJT, and MOSFET I-V and C-V characteristics by on-wafer probing. SPICE model parameter extraction. COREQ: ECE 323.
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