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  • 4.00 Credits

    Offers elective credit for courses taken at consortium institutions.
  • 4.00 Credits

    Covers transistors and op-amp circuits with emphasis on real devices and their performance, analog IC design concepts and building blocks, feedback and stability, oscillators, A/D and D/A converters and mixed-signal circuits, active filters, and other design topics at the discretion of the course instructor. Uses SPICE CAD simulation to support design work.
  • 1.00 Credits

    Accompanies ECE U600. Consists of laboratory hardware design exercises leading to a design project in which students prototype, test, and verify their designs as well as run computer simulations using SPICE.
  • 4.00 Credits

    Seeks to develop an understanding of the operation and performance of the basic semiconductor devices and IC components and their application in analog and digital circuit design. Devices treated include p-n junctions, bipolar junction transistors (BJTs), and metal-oxide-semiconductor field effect transistors (MOSFETs). Passive IC elements treated include resistors, capacitors, and inductors. Covers the necessary elements of solid-state theory including crystal structure, quantum theory, and carrier (electron and holes) transport theory.
  • 4.00 Credits

    Provides an overview of integrated circuit fabrication from the viewpoint of a process engineer. Students fabricate micro- and nanoscale devices in integrated lab sessions. Focuses on the physics, chemistry, and technology of integrated circuit fabrication in the lecture portion of the course, while students fabricate and test novel devices (an electrohydrodynamic micropump and three-dimensional carbon nanotube interconnects) in integrated lab sessions. Concentrates on silicon IC technology but also includes examples from other materials and device systems including microelectromechanical (MEMS) technologies that are used to build devices such as accelerometers, pressure sensors, and switches for telecommunications and other current examples provided from nanofabrication and nanotechnology. Lab hours are arranged.
  • 4.00 Credits

    Explores a wide range of new technologies based on, or influenced by, breakthroughs in nanoscience. Includes such nanotechnologies (the refinement of functional properties of materials, devices, or systems that are in at least one dimension smaller than 100 nm) as spintronics, quantum computing, carbon nanotube electronics, nanoparticle cancer remediation strategies, biomolecular electronics, and nanomachines. A general goal is the engineering of new or enhanced macroscopic properties from nanostructure or nanoscale materials and components. Offers review of the scientific literature, classroom lecture, seminars by international leaders of nanotechnology, and student team projects to enable the student to become well versed in this important burgeoning field.
  • 4.00 Credits

    Covers parallel and distributed processing concepts including concurrency and its management, models of parallel computation, and synchronous and asynchronous parallelism. Topics include simple parallel algorithm formulation, parallelization techniques, interconnection networks, arrays, trees, hypercubes, message routing mechanisms, shared address space and message-passing multiprocessor systems, communication cost and latency-hiding techniques, scalability of parallel systems, and parallel programming concepts and application case studies. Provides an introduction to processing and analysis of digital images with the goal of recognition of simple pictorial patterns. Topics include discrete signals and systems in 2-D, digital images and their properties, image digitization, image enhancement, image restoration, image segmentation, feature extraction, object recognition, and pattern classification principles (Bayes rules, class boundaries) and pattern recognition methods.
  • 4.00 Credits

    Presents an overview of modern communication networks. The concept of a layered network architecture is used as a framework for understanding the principal functions and services required to achieve reliable end-to-end communications. Topics include service interfaces and peer-to-peer protocols, a comparison of the OSI (open system interconnection) reference model to the TCP/IP (Internet) and IEEE LAN (local area network) architectures, network-layer and transport-layer issues, and important emerging technologies such as Bluetooth and ZigBee.
  • 1.00 Credits

    Accompanies ECE U628. Presents a detailed examination of the operation of the Internet using a lab-based approach supplemented with readings and brief lectures. Provides in-depth examination of the design and performance of the TCP/IP protocol suite. Emphasizes IP and TCP layer issues primarily, including addressing, routing, congestion-control, reliable vs. best-effort transport, IP address depletion, and mobility. Involves the implementation of a protocol in the lab as students conduct experiments with commercial network equipment and measurement gear and utilize simulation tools.
  • 4.00 Credits

    Introduces robotics analysis covering basic theory of kinematics, dynamics, and control of robots. Develops students' design capabilities of microprocessor-based control systems with input from sensory devices and output actuators by having teams of students design and implement a small mobile robot system to complete a specific task, culminating in a competition at the end of the course. Covers actuators, sensors, system modeling, analysis, and motion control of robots.
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