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Institution:
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Gonzaga University
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Subject:
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MECHANICAL ENGINEERING
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Description:
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Introduction to the fundamentals of mechanical design and analysis of electronic systems. Topics will include packaging architectures, component and subcomponent design (i.e. chip packaging technologies, printed circuit boards, interconnections and connectors, etc.), thermal management techniques, thermomechanical analysis and design, design for dynamic environments, and design techniques for humid and/or corrosive environments.
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Credits:
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3.00
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Credit Hours:
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Prerequisites:
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Corequisites:
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Exclusions:
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Level:
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Instructional Type:
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Lecture
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Notes:
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Additional Information:
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Historical Version(s):
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Institution Website:
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Phone Number:
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(509) 328-4220
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Regional Accreditation:
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Northwest Commission on Colleges and Universities
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Calendar System:
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Semester
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