MTSE 5530 - Integrated Circuit Packaging

Institution:

University of North Texas

Subject:

Materials Science&Engineering

Description:

5530. Integrated Circuit Packaging. 3 hours. Basic packaging concepts, materials, fabrication, testing and reliability, as well as the basics of electrical, thermal and mechanical considerations as required for the design and manufacturing of microelectronics packaging. Current requirements and future trends are presented. General review of analytical techniques used in the evaluation and failure analysis of microelectronic packages. Prerequisite(s): MTSC 5500 or consent of department.

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.unt.edu

Phone Number:

(940) 565-2000

Regional Accreditation:

Southern Association of Colleges and Schools

Calendar System:

Semester

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