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Institution:
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Rochester Institute of Technology
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Subject:
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Description:
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This course focuses on the deposition and etching of thin fi lms of conductive and insulating materials for IC fabrication. A thorough overview of vacuum technology is presented to familiarize the student with the challenges of creating and operating in a controlled environment. Chemical Vapor Deposition (CVD) and electroplating technologies are discussed as methods of film deposition. Plasma etching and Chemical Mechanical Planarization (CMP) are studied as methods for selective removal of materials. Applications of these fundamental thin fi lm processes to IC manufacturing are presented. (0305-320, 350) Class 3, Lab 3, Credit 4 (S, SU)
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Credits:
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3.00
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Credit Hours:
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Prerequisites:
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Corequisites:
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Exclusions:
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Level:
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Instructional Type:
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Multiple
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Notes:
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Additional Information:
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Historical Version(s):
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Institution Website:
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Phone Number:
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(585) 475-2411
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Regional Accreditation:
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Middle States Association of Colleges and Schools
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Calendar System:
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Quarter
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