MCEN 5166 - Electronics Packaging and Manufacturing

Institution:

University of Colorado Boulder

Subject:

Description:

To provide basic knowledge of the technologies and processes required for the packaging and manufacturing of electronic products. Topics covered include wafer fabrication, different levels of packaging, thermal management, life cycle engineering, printed wiring board assembly processes, and process control.

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.colorado.edu

Phone Number:

(303) 492-1411

Regional Accreditation:

North Central Association of Colleges and Schools

Calendar System:

Semester

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