MS 458 - Materials for Electronic Packaging

Institution:

Alfred University

Subject:

Description:

3 hours. Electronic package systems for information processing include the function of electrical interconnection, cooling and physical support for the sets of semiconductor I.C. chips plus other components in electronic systems. Semiconductors, ceramics, polymers and metals are generally used in combinations in all packages; and, hence, it is necessary to understand their bulk properties as well as their interface structures and characteristics. This course focuses on the design of materials and processing needs for packaging technology from chip to board using principles involved in key areas of materials science and engineering disciplines. Basic properties and processing methods used in the design and fabrication of semiconductor IC's, ceramic substrates, metal interconnections, and polymers are discussed. Prerequisites: CEMS 314, 344. CE

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.alfred.edu

Phone Number:

(607) 871-2111

Regional Accreditation:

Middle States Association of Colleges and Schools

Calendar System:

Semester

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