MSE 461 - Microelectronic Packaging Materials

Institution:

Boise State University

Subject:

Description:

Engineering analysis of electronic packaging materials and their effect on electrical design, assembly, reliability, and thermal management. Selection process for packaging materials, manufacturing and assembly, single and multi-chip packaging. PREREQ: ENGR 245.

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.boisestate.edu

Phone Number:

(208) 426-1011

Regional Accreditation:

Northwest Commission on Colleges and Universities

Calendar System:

Semester

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