CBEMS 174 - Semiconductor Device Packaging

Institution:

University of California-Irvine

Subject:

Description:

Introduction to the semiconductor device packaging and assembly processes. Electrical, thermal, optical, and mechanical aspects of package design and reliability. Special topics on optoelectronics packaging are covered. Prerequisite: CBEMS40A or CBEMS45B or consent of instructor. (Design units: 1)

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.uci.edu/

Phone Number:

(949) 824-5011

Regional Accreditation:

Western Association of Schools and Colleges

Calendar System:

Quarter

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