TEL 265 - Characterization, Packaging and Testing of Nanofabrication Structures

Institution:

Delaware County Community College

Subject:

Electronics Technology

Description:

This course examines a variety of techniques and measurements essential for controlling device fabrication and final packaging. Students will revisit concepts such as residual gas analysis introduced in TEL 261, optical emission spectroscopy (OES) and end point detection as introduced in TEL 263. Characterization techniques such as surface profilometry, advanced optical microscopy, optical thin film measurements, ellipsometry, and resistivity/conductivity measurement will be implemented on nanofabricated samples. Basic electrical measurements on device structures for yield analysis and process control will also be stressed. These will include breakdown measurements, junction testing, and C-V and I-V tests and simple transistor characterization. In addition, students will examine mechanical as well as electrical characterizations of nanostructures for biological/biomedical applications. The students will perform DNA analysis by learning and performing the polymerase chain reaction for DNA replication. They will also study and manufacture microfluid channels for biological analysis. An extensive overview of biology will be given with emphasis on biocompatible materials. The students will also learn about the manufacturing issues involved in subjects such as interconnects, isolation, and final device assembly. The importance of planarization techniques such as deposition/etchback and chemical/mechanical polishing will be emphasized. Lastly, packaging procedures such as die separation, inspection bonding, sealing and final test for both conventional IC's and novel MEM and biomedical devices will be examined. Upon successful completion of this course, students should be able to: Describe various process monitoring techniques used in nanofabrication; Design a process flow for a NMOS transistor from wafer preparation to packaging; Present the NMOS transistor overflow in power point format, with emphasis on process interrelationships; Describe various material characterization techniques used in nanofabrication; Use the C/V and I/V testing techniques utilizing devices made using the process flows of TEL 262; Identify the equipment employed for final assembly; Explain the processes of final assembly; Describe the importance of nanofabricated biocompatible materials; Replicate and quantify DNA fragments utilizing the polymerarase chain reaction and gel electrophoresis; Describe the issues associated with metalization and planarization; Identify the equipment associated with metalization and planarization; Operate equipment for metalization; Describe the test procedures associated with packaging; Describe the issues associated with packaging; Identify the equipment associated with packaging.

Credits:

3.00

Credit Hours:

Prerequisites:

TEL 260, TEL 261, TEL 262, and TEL 263

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.dccc.edu

Phone Number:

(610) 359-5000

Regional Accreditation:

Middle States Association of Colleges and Schools

Calendar System:

Semester

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