ME 447 - Heat Transfer in Electronic Packaging

Institution:

Saint Martin's University

Subject:

Description:

Background on materials used in electronics manufacturing and their thermal properties. Failures in electronics due to thermal reasons, contact resistance and miniature heat pipes will be covered. Design projects will be designed. Prerequisites: ME 347/ME 347L.

Credits:

3.00

Credit Hours:

Prerequisites:

Corequisites:

Exclusions:

Level:

Instructional Type:

Lecture

Notes:

Additional Information:

Historical Version(s):

Institution Website:

www.stmartin.edu

Phone Number:

(360) 491-4700

Regional Accreditation:

Northwest Commission on Colleges and Universities

Calendar System:

Semester

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