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Institution:
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University of Kentucky
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Subject:
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Description:
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Study of packaging systems which interconnect, support, power, cool, protect, and maintain electronic components. The course will address systems at the chip, board, and product levels. Topics include design, properties, materials, manufacture, and performance of various packaging systems. Laboratory will provide familiarity with design software and production equipment and processes. Prereq: EE 211 or EE 305, EE 360 or MSE 402G, or consent of instructor. (Same as MSE 569.)
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Credits:
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3.00
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Credit Hours:
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Prerequisites:
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Corequisites:
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Exclusions:
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Level:
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Instructional Type:
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Lecture
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Notes:
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Additional Information:
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Historical Version(s):
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Institution Website:
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Phone Number:
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(859) 257-9000
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Regional Accreditation:
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Southern Association of Colleges and Schools
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Calendar System:
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Semester
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